major ratings and characteristics features low profile space ideal for automated placement glass passivated chip junctions low forward voltage drop low leakage current high forward surge capability high temperature soldering 260 /10 seconds at terminals component in accordance to rohs 2002/95/1 and weee 2002/96/ec mechanical date case: jedec sod-123fl molded plastic body over glass passivated chip terminals: solder plated, solderable per j-std-002b and jesd22-b102d polarity: laser band denotes cathode end weight: 0.017gram maximum ratings & thermal characteristics & electrical characteristics (t a = 25 c unless otherwise noted) symbol 0. 5a 0. 5b 0. 5d 0. 5g 0. 5j 0. 5k 0.5m unit v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a i fsm a v f v i r a t rr 250 ns c j p f t j , t stg operating junction and storage temperature range C55 to +150 maximum instantaneous forward voltage at 0.5a 1.3 maximum dc reverse current t a = 25 at rated dc blocking voltage t a = 100 5.0 50 maximum reverse recovery time at i f = 0.5 a , i r = 1.0 a , i rr = 0.25 a 150 500 typical junction capacitance at 4.0 v ,1mhz 15 dfr- maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 0.5 peak forward surge current 8.3 ms single half sine- wave superimposed on rated load 15 v f 1.3v t j max. 150 c i fsm 15 a i r 5 a i f(av) 0.5 a v rrm 50 v to 1000 v dfr0.5a-dfr0.5m surface mount fast recovery rectifiers http://www.luguang.cn mail:lge@luguang.cn
characteristic curves (t a =25 unless otherwise noted) dfr0.5a-dfr0.5m surface mount fast recovery rectifiers http://www.luguang.cn mail:lge@luguang.cn
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